The POU3500 procedure delivers dynamic temperature Charge of the process chamber cathode / electrode / anode and can be synchronized with any etch system.
thirty% of its peak energy usage, presenting our buyers considerable reduction in running charges and greater reliability.
With all the POU3500, you could reach unparalleled results in etch efficiency, chamber uptime, decreased expense of possession and fab space utilization – all whilst increasing your method trustworthiness.
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LAUDA-Noah will, for just a buyer's retrofit evaluation, keep an eye on and change its fluid temperature Manage profiles to match an existing TCUs' if you want to guarantee a clean procedure integration through DAQ.
The accuracy with the POU 3300 permits impartial Charge of the method fluid temperature on the wafer chuck within +/- 0.1 °C of set issue, plus the rapidly reaction time from the process lets for max wafer-to-wafer repeatability through the etch process.
The accuracy of the POU 3500 permits independent control of the method fluid temperature for the wafer chuck within just +/- 0.1 °C of set point, as well as rapidly response time of your program will allow for optimum wafer-to-wafer repeatability through the entire etch approach.
With our unit strategically mounted roughly six toes with the chamber, we accomplish a much more correct studying of your chuck temperature. This technique makes certain reliable temperature all over the manufacturing large amount, resulting in enhanced wafer-to-wafer CD uniformity.
the info pertains to a 300mm chamber temperature profile through a significant facet ratio Etch approach, operating at incredibly higher RF ability circumstances (~3.8kW). The powerful areas of this knowledge set are:
Dynamic Temperature Regulate, as implemented in methods similar to the LAUDA-Noah POU, is surely an technique that senses the temperature of the procedure fluid getting back from the process chamber’s wafer chuck (ESC) and dynamically adjusts the temperature on the provided procedure fluid based on this serious-time responses.
the info established Here's from the 200mm quantity generation wafer fab and Obviously illustrates the good thing about the LAUDA-Noah POU system.
The POU3300 system gives dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with any etch course of action.
verified; TEs' characterize just one A part of a chiller's layout. The switching & control methods utilized by a chiller will affect the TEs' trustworthiness.
(as a result, setting up a static unit beside chamber will never help it to supply dynamic temperature Handle)
We call for a lot less cooling/heating capacity for a similar application like a static TCU because of our compact reservoir volume.